TPM-Thermal Solutions

BYD Electronics is seeking a Technical Program Manager (TPM) to support the development and delivery of thermal solutions for data center and server platforms. As an OEM supplier, this role will act as the technical interface between our engineering teams and our data center/server customers, ensuring successful product development, integration, and deployment.

The TPM will coordinate cross-functional teams across thermal engineering, mechanical design, manufacturing, and customer engineering teams to drive programs from concept through mass production while meeting customer performance, quality, and schedule requirements.

• Serve as the primary technical and program contact for data center/server customers.

• Work closely with customer engineering teams to understand system thermal requirements, server architecture, and integration constraints.

• Support technical discussions, design reviews, and issue resolution throughout the product lifecycle.

• Manage end-to-end programs for thermal solutions including heat sinks, heat pipes, vapor chambers, liquid cooling components, and related assemblies.

• Develop and maintain program schedules, milestones, and deliverables.

• Track risks, issues, and dependencies to ensure successful program execution.

• Coordinate internal teams including thermal engineering, mechanical design, manufacturing, quality, and supply chain.

• Drive alignment between product design, testing, and manufacturing readiness.

• Facilitate cross-functional communication to resolve technical and program challenges.

• Support product development phases including design validation, prototype builds, and engineering verification testing.

• Work with manufacturing teams to support New Product Introduction (NPI) and production ramp.

• Ensure products meet thermal performance, reliability, and quality requirements.

• Support system-level thermal integration for server platforms and data center infrastructure.

• Assist with performance evaluation, troubleshooting, and root cause analysis when thermal issues arise.

• Work with customers to optimize thermal performance for high-power computing environments.

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, Electrical Engineering, or related field.

• 5+ years of experience in technical program management, engineering program management, or hardware project management.

• Experience working with thermal solutions such as heat sinks, heat pipes, vapor chambers, cold plates, or liquid cooling systems.

• Experience supporting OEM customers in server, electronics, or hardware industries.

• Strong cross-functional coordination and project management skills.

• Excellent communication and problem-solving abilities.

• Experience supporting data center, server platforms, or high-performance computing systems.

• Familiarity with AI servers, GPU platforms, or high-power server thermal design.

• Knowledge of NPI processes and manufacturing operations.

• Experience with program management tools such as JIRA, Smartsheet, or MS Project.

• Bilingual in Mandarin preferred.