Manufacturing Engineer
Quick Summary
Ability to work under a microscope for extended periods of time Ability to have eye to hand dexterity and fine motor skills
requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
We are seeking a motivated engineer with hands-on experience in microelectronics assembly to play a critical role at our facility in Torrance, CA. This role offers a unique opportunity to combine technical acumen with project leadership skills. The ideal candidate is a self-starter, comfortable working in a dynamic environment, and eager to take on a key role in highly visible projects.
Responsibilities
~1 min read- →Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
- →Qualify new products and new product lines at Torrance production site.
- →Collaborate with other functional groups to develop wire bond solutions to meet business needs.
- →Provide training in die-assembly, wire bond technology, problem analysis and resolution.
- →Must have knowledge and understanding of:
- →Ability to work under a microscope for extended periods of time
- →Ability to have eye to hand dexterity and fine motor skills
Requirements
~1 min readThis role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.
- Level II: requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
- Level III: requires a minimum of 4 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
- Level IV: requires a minimum of 6 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
- Bachelor’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering.
- Extensive experience with Microelectronic device process development including Eutectic die attach, precision pick and place and wire-bonding machines. Good analytical and problem-solving skills
- Self-motivated, able to work independently and self-initiative personality
- Possesses good communication skills, interpersonal skills and ability to work with multi-functional teams
Location & Eligibility
Listing Details
- Posted
- August 24, 2026
- First seen
- September 25, 2026
- Last seen
- September 26, 2026
Posting Health
- Days active
- 0
- Repost count
- 1
- Trust Level
- 11%
- Scored at
- September 25, 2026
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