Process Engineer
Quick Summary
PROCESS ENGINEER Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century.
Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.
Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.
Responsibilities
~1 min read- →Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
- →Design production processes from the lab bench through proof of concept and production ramp
- →Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
- →Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
- →Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
- →Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
- →Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
- →Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield
Requirements
~1 min read- B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field
- Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
- Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
- Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
- Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
- Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
- Willingness to work extended hours and weekends as needed
Nice to Have
~1 min read- Direct experience qualifying or operating production equipment in a high-volume production environment
- Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
- Familiarity with statistical process control and root cause analysis methods
- 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
What We Offer
~1 min readListing Details
- Posted
- March 19, 2026
- First seen
- March 26, 2026
- Last seen
- April 17, 2026
Posting Health
- Days active
- 21
- Repost count
- 0
- Trust Level
- 48%
- Scored at
- April 17, 2026
Signal breakdown
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