Mechanical Design Engineer

Microamp Solutions is seeking qualified, energetic individuals (Junior / Mid / Senior) to specify, design, and develop mechanical systems and solutions for cutting-edge 5G mmWave Radio Units. As a Mechanical Design Engineer, you will focus on mechanical system design, prototyping, deployment, and validation.

• Full product lifecycle management: from initial system concept, through detailed mechanical design, simulation, and prototyping, to testing, verification, integration, and production support.

• Ensuring robust and cost-effective designs that meet performance, manufacturability, and regulatory standards.

• Collaborating with cross-functional teams to optimize enclosure performance.

• Preparing high-quality technical documentation (3D models, 2D drawings, BOMs, and manufacturing data packs).

• Performing tolerance analysis, material selection, and design for manufacturing (DFM) and assembly (DFA).

• Supporting production and troubleshooting mechanical issues during system integration and testing.

• BSc, MSc or PhD, equivalent in technical or scientific discipline (Mechanical Engineering, Mechatronics preferred) or equivalent work experience,

• Proficiency in 3D CAD software (e.g., SolidWorks, CATIA, Creo, or Siemens NX) for modeling and simulation.

• Understanding of RF shielding principles, including EMI/EMC requirements, gasket design, and conductive coatings.

• Experience with thermal management solutions for RF enclosures, such as heat sinks, thermal interfaces, and airflow design.

• Knowledge of materials suitable for RF enclosures (e.g., aluminum, copper, stainless steel, and specialized coatings).

• Knowledge of manufacturing processes, including CNC machining,die casting, extrusion, machining, and surface treatments for enclosures.

• Your confidence, trustworthiness, and general excitement of technology is a must!

• Understanding of materials selection and their properties (e.g., metals, plastics, composites).

• Familiarity with mechanical design standards and best practices.

• Familiarity with structural design and vibration analysis for enclosures.

• Experience in finite element analysis (FEA) for structural, thermal, and dynamic simulations.

• Knowledge of thermal management solutions for electronic systems (e.g., heat sinks, thermal interfaces, and airflow design).

• Experience in designing for regulatory compliance (e.g., CE, FCC, or other industry standards).