Advanced Package Design Engineer

At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

• →Design silicon and organic interposers for advanced packaging solutions
• →Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
• →Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
• →Create and maintain layout design rules, stack-ups, and layout guidelines
• →Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

• Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
• 3+ years of experience in semiconductor package design or layout
• Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
• Understanding of high-speed signal routing, power distribution networks (PDN)
• Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
• Effective communication skills and ability to work in a fast-paced, cross-functional environment

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• 5+ years of experiences in advanced packaging layout design
• Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
• Proven understanding of high-speed signal routing, power distribution networks (PDN)
• Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.