Quick Summary
Responsibilities include electrical packaging of PCBAs including enclosures, sealing, connectors, wire harness, and thermal interfaces. Hands on prototype building to accelerate product development.
Comfortable working in a fast-paced environment and being scrappy. Bachelor's Degree in Mechanical Engineering, Aerospace Engineering, or equivalent. 3+ years of experience designing, testing,
Responsibilities
~1 min read- →
Responsibilities include electrical packaging of PCBAs including enclosures, sealing, connectors, wire harness, and thermal interfaces.
- →
Hands on prototype building to accelerate product development.
Requirements
~1 min readComfortable working in a fast-paced environment and being scrappy.
Bachelor's Degree in Mechanical Engineering, Aerospace Engineering, or equivalent.
3+ years of experience designing, testing, and fielding high volume products.
Demonstrated experience designing tightly integrated products that live in harsh, outdoor environments (IP67, MILSTD810G/H or higher).
Experience in doing tolerance analysis for prototyping and mass production.
Hands on experience with tests (shock, vibe, thermal, EMC ).
Experience designing for different manufacturing methods including machining, injection molding, casting, and sheet metal parts.
Exceptional organization and communication skills (both written and oral).
Experience with coupled thermal analysis, design, and simulation for high density power dissipation. Preferred qualifications include experience with designing thermal solutions for air and liquid cooling.
Experience with thermal, structural and modal analysis including first order modeling. Experience with FMEA (Ansys or similar) preferred.
Experience or exposure to EE and RF systems and packaging of pcba components and antenna elements.
Proficient with Solidworks or equivalent.
Proficient with Ansys Thermal and Structural analysis tools.
Experience in ECO, BOM and deviation process management.
Experience in using gd&t to draft drawings for manufacturing.
Solidworks preferred (our current 3d software).
ANSYS Multiphysics simulation.
Familiarity with ECAD integration.
Location & Eligibility
Listing Details
- Posted
- October 3, 2025
- First seen
- September 25, 2026
- Last seen
- September 26, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 19%
- Scored at
- September 26, 2026
Signal breakdown
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