TM-Firmware Engineer(Local)-Shenzhen
China·ShenzhenmidEngineeringEmbedded Engineer
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Quick Summary
Overview
工作职责： 1. 负责空调产品单板软硬件设计开发； 2.负责市场及生产问题的处理和解决； 3.上级主管交付的其他工作。 职位要求： 1.本科及以上学历，电气、电子、计算机、自动控制及相关专业； 2.有电子产品单板软、硬件开发经验； 3. 熟练掌握单片机或DSP相关开发环境，熟练掌握C ，C++ 汇编语言编程； 4. 熟悉CAN, RS485,ETHERNET, PLC； 5.
Technical Tools
EngineeringEmbedded Engineer
工作职责：
1. 负责空调产品单板软硬件设计开发；
2.负责市场及生产问题的处理和解决；
3.上级主管交付的其他工作。
职位要求：
1.本科及以上学历，电气、电子、计算机、自动控制及相关专业；
2.有电子产品单板软、硬件开发经验；
3. 熟练掌握单片机或DSP相关开发环境，熟练掌握C ，C++ 汇编语言编程；
4. 熟悉CAN, RS485,ETHERNET, PLC；
5.能独立思考和解决问题，勤奋认真,善于团队合作。
6.英语四级以上
Location & Eligibility
Where is the job
Shenzhen, China
On-site at the office
Who can apply
CN
Listing Details
- Posted
- August 6, 2026
- First seen
- September 26, 2026
- Last seen
- October 7, 2026
Posting Health
- Days active
- 11
- Repost count
- 0
- Trust Level
- 15%
- Scored at
- October 7, 2026
Signal breakdown
freshnesssource trustcontent trustemployer trust
External application
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