kandou

Kandou AI is redefining the economics of AI infrastructure. Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that delivers high bandwidth and ultra‑low latency at dramatically lower power. Our architecture represents a foundational shift in how ne

Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible. Today we have one internship position av

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible. Today we have one internship position av

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

We at Kandou are a team of passionate professionals striving to make a mark in the trajectory of the semiconductor industry. Our list of customers reads like a who’s is who of the technology world. If you love to be part of an adventure of a start-up challenging established tech giants and you are a

Kandou is looking for an Lead AI Architect to help design, build, evaluate, and deploy advanced AI agent systems for real-world use cases. This role is focused on agentic systems that go beyond conversational assistants: complex analytical workflows, knowledge-based reasoning systems, controlled inf

Firmware Engineer (6-month contract) in Lausanne. 3 days on site per week. Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chi

At Kandou, we are redefining the economics of AI infrastructure. Our current product line includes PCIe and USB Retimers. We are defining new chiplets-based AI fabric solutions built using our innovative, proven Copper MIMO links. Kandou started their India operations in Q1 of 2026 and has plans to e

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-ba