Mold and Symbol Trim Form (EOL) Equipment Engineer (MES Project)

Join TI as a specialized Equipment Engineer to drive the digital transformation of our to drive the digital transformation of our End-of-Line (EOL) manufacturing, specifically covering Mold and Symbol Trim Form (STF) operations. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

• →MES Implementation (Project Phase): Represent EOL Equipment Engineering in the MES rollout. Define equipment workflows, setup/recipe controls, qualification requirements, equipment states, and interlocks for both Mold and STF machines.
• →Digital Integration: Translate physical shop-floor requirements (e.g., Mold cure/pressure/temp and STF mechanical/trimming parameters) into digital process designs and data collection needs.
• →Validation: Validate equipment integration scenarios and support User Acceptance Testing (UAT) and deployment for both process areas.
• →Sustaining (Post-Project Phase): Transition to production to manage equipment reliability, troubleshoot MES-related equipment issues, and drive continuous improvement in automation and uptime.
   

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in with Mold equipment (e.g., Towa, ASM) AND/OR Symbol Trim Form equipment (e.g., ASM, Besi) with minimum 2 years of relevant experience 

• Experience with tool monitoring/interdiction software and SPC techniques.
• Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship