Intern, Process Engineering
Quick Summary
Semiconductor process development for oxidation, annealing, curing, ALD, PEALD, Epitaxy, and PECVD technologies Process development activities supporting logic, memory, analog, power,
ASM’s internship program offers a hands-on opportunity to experience the fast-paced and innovative semiconductor industry. As an R&D Process Engineering Intern, you will work alongside experienced engineers on real-world development projects and gain exposure to ASM’s core technologies.
This program is designed to help develop the next generation of engineering talent by providing practical learning, technical mentorship, and insight into professional engineering roles within a global semiconductor equipment company.
This is a paid, full-time, on-site internship based in Dongtan, Korea.
The internship is expected to start in September 2026 and run through December 2026 (approximately 16 weeks).
This program is intended for students who are currently enrolled in a full-time academic program. Candidates who have already graduated and are not returning to school should apply for ASM’s Early Career opportunities instead.
Responsibilities
~1 min readAs part of ASM’s R&D Process Engineering team, you will support the research, development, and optimization of advanced semiconductor processes and equipment, including:
- →Semiconductor process development for oxidation, annealing, curing, ALD, PEALD, Epitaxy, and PECVD technologies
- →Process development activities supporting logic, memory, analog, power, and MEMS applications
- →Hands-on learning with advanced process tools, analytical equipment, and characterization techniques used in R&D environments
- Learn the fundamentals of ALD and PEALD technologies, contributing to thin film optimization aligned with customer requirements
- Support improvement of PEALD metal oxide and nitride film properties, gaining exposure to reactor design, process concepts, and characterization methods
- Assist in optimizing PEALD process parameters and correlating electrical characterization results with physical film properties
- Understand and help develop wafer uniformity control parameters for film thickness and composition
- Analyze experimental data and document correlations between on-wafer results and equipment or hardware parameters
Responsibilities
~1 min read- →Strong self-motivation and a structured, problem-solving mindset
- →Currently pursuing a Master’s or PhD degree in Chemistry, Chemical Engineering, Physics, Materials Science, or Electrical Engineering
- →Basic knowledge of materials characterization techniques
- →Interest in semiconductor device fabrication and process development
- →Ability to work effectively in a team-oriented, R&D-focused environment
- Prior exposure to semiconductor device fabrication
- Experience or coursework related to plasma reactors or plasma-based processes
- Curiosity and enthusiasm for hands-on experimentation and data-driven analysis
What We Offer
~1 min readWe make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
Listing Details
- Posted
- April 16, 2026
- First seen
- March 26, 2026
- Last seen
- April 16, 2026
Posting Health
- Days active
- 20
- Repost count
- 0
- Trust Level
- 58%
- Scored at
- April 16, 2026
Signal breakdown
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