ericsson1h ago
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Modular Test Bed System Design Engineer
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EngineeringDesign Engineer
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Quick Summary
Key Responsibilities
1\. Modular Test Bed System Architecture &
Technical Tools
EngineeringDesign Engineer
## Join our Team
About this opportunity:
The Modular Test Bed System Design role focuses on defining, systemizing, and evolving the architecture and technical capabilities of both MIB and DFE Modular Test Bed platforms used for early‑phase technology validation, ASIC bring‑up, RF testing, algorithm development, and Radio HW/SW integration. This position requires strong system-level expertise across digital hardware, RF systems, and mixed‑signal domains, as well as excellent cross-functional collaboration and communication skills in a global R&D environment.
What you will do:
1\. Modular Test Bed System Architecture & Requirements
\- Define and refine architecture for MIB and DFE radio test bed platforms including system behavior, data paths, interfaces, and performance requirements.
\- Translate Radio, ASIC, DFE, and product programs need Modular Test Bed system specifications.
\- Conduct feasibility studies, concurrency analyses, system modeling, and interface definitions.
2\. Systemization of MIB/DFE Modular Test Bed
\- Drive system-level definition across MIB TB, DFE TB, TRXIC, FPGA and SW components.
\- Ensure consistency and compatibility across Modular Test Bed hardware and software ecosystems.
3\. Hardware System Design
\- Expertise across Digital HW, Radio HW, and mixed-signal behavior.
\- Define system constraints, requirements, and HW/SW partitioning rules.
4\. E2E Hardware Lifecycle Alignment
\- Contribute across all HW lifecycle phases.
\- Align Modular Test Bed development methodology with Radio, ASIC, TRXIC, DFE processes.
5\. Industrialization & Cross-functional Collaboration
\- Collaborate with Sourcing, Factory, PTD.
\- Support PCB layout reviews, prototypes, DFM/DFT checks.
6\. Validation Strategy & Debug
\- Define Modular Test Bed validation coverage.
\- Work on system-level debug across HW/SW/ASIC.
7\. Documentation & Technical Communication
\- Produce clear documentation and interface specs.
\- Facilitate cross-team alignment.
The skills you bring:
\- Master’s degree in EE/CE/Telecom.
\- 7+ years’ experience in system/hardware/RF design.
\- Experience in Modular Test Bed system design across MIB and DFE Modular Test Bed.
\- Strong Radio System technical background.
\- Expertise in HW system architecture, digital HW, radio HW.
\- Familiarity with RF/DFE/TRXIC validation.
\- Strong cross-functional communication.
\- Collaboration & teamwork.
\- Structured problem solving.
\- Ownership & accountability.
\- System thinking & big-picture mindset.
\- Documentation & presentation skills.
\- Adaptability & learning attitude.
\- Stakeholder management.
\- Organization & coordination.
Why join Ericsson?At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.
What happens once you apply?Click Here to find all you need to know about what our typical hiring process looks like.Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.
Primary country and city: China (CN) || Beijing
Req ID: 785101
Location & Eligibility
Where is the job
—
Location terms not specified
Listing Details
- Posted
- May 19, 2026
- First seen
- May 19, 2026
- Last seen
- May 19, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 51%
- Scored at
- May 19, 2026
Signal breakdown
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External application · ~5 min on ericsson's site
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