Engineering Technician / Micro-Electronic Wire Bonder Technician

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Under close to moderate supervision, performs a wide range of electronic, micro-electronic, and electro-mechanical assembly and technical support tasks. Responsibilities include building and assembling units such as printed circuit assemblies (PCAs), modules, and subassemblies, as well as performing precision micro-electronics work including wire bonding under a microscope. This role supports production and engineering by executing assembly processes, assisting with troubleshooting, and ensuring product quality, reliability, and compliance with established manufacturing standards.

• →Assemble electronic and electro-mechanical subassemblies following production drawings, work instructions, and engineering documentation.
• →Perform precision micro-electronics assembly, including wire bonding operations (ball and wedge bonding) using specialized bonding equipment under a microscope.
• →Interpret schematics, wiring diagrams, bills of material (BOMs), and manufacturing instructions to determine required components and processes.
• →Install and connect electronic components onto PCBs and substrates.
• →Perform soldering and de-soldering on through-hole and surface-mount components.
• →Set up, operate, and maintain wire bonding equipment, ensuring proper bond integrity.
• →Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools.
• →Perform rework, repair, and troubleshooting of assemblies.
• →Support engineering activities including process improvements and documentation updates.
• →Use hand tools, microscopes, jigs, and fixtures to assemble and secure components.
• →Perform epoxy application, encapsulation, curing, and cleaning processes.
• →Conduct in-process inspections and visual checks to ensure quality standards are met.
• →Maintain accurate production records and documentation.
• →Follow all safety and ESD procedures.
• →Maintain a clean and organized work environment.

• High school diploma or equivalent required; technical training preferred.
• 0–3 years of experience in electronic assembly, micro-electronics, or wire bonding.
• Experience with microscope work and fine motor skills required.
• Basic understanding of electronic components and schematics.
• Ability to perform soldering and micro-assembly tasks to standard
• Familiarity with ESD controls and IPC standards preferred.
• Strong attention to detail and ability to work with small components.
• Ability to follow detailed instructions and procedures.
• Basic troubleshooting skills.
• Good manual dexterity and hand-eye coordination.
• Ability to work effectively in a team environment.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​