GE Vernova Grid Solutions - Hardware Engineering Intern (Critical Infrastructure Communications) – Spring/Summer 2027

Are you passionate about innovation? Are you excited at the opportunity to electrify and decarbonize the world?

We operate with a founder’s mindset. We deliver innovation with passion, speed, and courage. We continuously challenge our thinking and are empowered to dream big and take smart risks.

As a Hardware Engineering Co-op, you will be an active contributor to:

• Learn and enhance your existing Electrical Engineering skills by applying them to hardware design for real world applications.

• Experience challenging assignments in the communications industry developing products that target energy, oil and gas, mining, water/waste water, and transportation.

• Receive technical training, mentorship, and coaching from world-class technologists and technical managers.

• Grow your technical expertise in hardware design and expand your skills in new areas.

• Gain exposure to industrialization at our onsite manufacturing plant in Rochester, NY.

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  Work on an assignment / project within engineering & technology to stretch your learning and skillset.

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  Report progress and status to project management.

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  Perform rough estimates of time required to implement features and resolve issues, helping with task prioritization.

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  Use your academic knowledge to complete assigned project(s), deliver positive outcomes, and contribute to the success of our team.

• Working towards a Bachelors or Masters degree in a technical field of study in Electrical Engineering Technology or Electrical Engineering.

• Enrolled in a full time matriculated and nationally accredited baccalaureate or graduate program.

• Completed at least two full years of college.

• Must be willing to work in geographical area specified by the business 

• Must have the ability to work in the US for an unlimited amount of time without sponsorship

At GE Vernova, we believe in the value of your unique identity, background and experiences. We are committed to fostering an inclusive culture, where everyone feels empowered to do their best work because they feel accepted, respected and that they belong. Click here to learn more:

Our Culture | GE Vernova

• Minimum 3.0 GPA (without rounding)

• Must be highly self-motivated and be able to work under minimal supervision

• Ability to follow hardware design principles and development processes.

• Experience with analog/digital design principles and circuitry.

• Experience with schematic entry tools (Altium, Orcad, etc.).

• Experience or exposure to PCB layout (Altium, PADS, PCAD, etc.). 

• Some knowledge of hardware physical layer interfaces such as Ethernet, USB, UARTs, I2C, SPI, etc.

• Some hands-on experience using test equipment in a lab environment (power supplies, oscilloscopes, multimeters, etc.).

• Some knowledge of wireless technology (4G LTE, Bluetooth, WiFi, etc.) preferred.

• An analytical approach to problem solving with a high degree of curiosity.

• Willingness and ability to learn from others.

• Willingness to make and learn from mistakes.

• Excellent organizational, written communication, and oral communication skills.

• Demonstrated leadership and team player.

• One who strives for academic excellence and shows great initiative.

• Desire to work in a fast paced and agile environment.

The pay range for this position is $1,000-$2,000 USD weekly.  The specific pay offered may be influenced by a variety of factors, including the candidate’s experience, education, and skill set.

For candidates applying to a U.S. based position only:

This posting is expected to remain open for at least seven days after it was posted on 9/3/2026.

U.S. Internship roles are ineligible for GE Vernova benefits.