Principal Digital Hardware Design Engineer - Onsite

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience.
• Significant design experience interfacing with complex embedded devices (microprocessors, FPGAs, memory, high-speed transceivers).
• Robust experience maturing design concepts from the block diagram or requirements level to development of complete, verified digital designs.
• Expertise with a schematic capture/circuit board layout CAD package.
• Experience working with standard lab equipment for integration and verification testing of hardware designs.

• One or more advanced degrees in Electrical Engineering or a related Science, Technology, Engineering, or Mathematics (STEM) major. 
• Experience designing at the circuit card stack level to meet concerns of adjacent disciplines, such as thermal, structural, mechanical, reliability, and quality.
• Experience with embedded test techniques, design for test, design for manufacturing, and/or design margin analysis
• Experience with a formal design process for circuit card assemblies.
• Proven ability to debug and resolve complex hardware issues during integration and qualification testing.
• Advanced knowledge of high-speed protocols, such as PCIe, Ethernet, and high-speed memory interfaces.
• Siemens Xpedition: xDX Designer, xPCB Layout, and/or Hyperlynx signal/power integrity.
• Experience with complex, multi-lamination circuit card assemblies between 16 and 32 layers
• Expertise with Xpedition's Constraint Editor System (CES), routing practices for high-speed signals, and  guiding Electronic Computer-Aided Design (ECAD) personnel through PCB layout  and technical drawing creation.
• Experience with FPGA code development or software
• Experience with performing circuit card assembly-level architecture trades, and/or with system-level power architecture trades.
• Experience documenting technical topics and presenting to customers and senior leadership.
• Demonstrated ability to lead successful teams.
• Experience managing technical, cost, and schedule risks and opportunities.
• Experience with project management tools such as Earned Value and/or Agile Execution.
• Experience communicating and documenting technical topics and presenting to customers and management.
• Experience leading a program transition from development to production.
• Proposal development experience.
• Experience with intellectual property generation (patents & publications).
• Demonstrated mentorship of junior engineers.

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

The Multi-Product Power & Digital (MPD) department designs FPGAs, circuit cards, and electronics subassemblies for a range of products including missiles/effectors, radars, and electronic warfare systems.  The team leverages digital, analog, and power design skills to provide support throughout the product lifecycle from architecture and design through production and sustainment.

The MPD department is seeking a Principal Digital Hardware Design Engineer to join our team. In this role, you will leverage advanced technologies to create cutting-edge solutions for sensor and effector products. You will partner with experienced, multidisciplinary teams to define requirements, develop architectures, execute detailed design and simulations, and perform integration and verification tasks. You will document your designs within the appropriate configuration management tools and provide comprehensive engineering support throughout the product lifecycle.

• →Drive requirements decomposition.
• →Lead trade studies and define architecture at the circuit card and/or sub-system level.
• →Lead the design, analysis, test, and documentation of digital electronics circuit card assemblies including embedded processors, FPGAs, memories, and industry standard interfaces such as PCIe, Ethernet, I2C, SPI, and UART.
• →Partner with ECAD drafters through stack up definition, pre/post-route simulation (SI/PI), layout, and routing activities.
• →Plan and execute integration and verification activities in engineering laboratories.
• →Provide product tests and troubleshooting support.  Support root cause failure investigations.
• →Define schedules for circuit card and sub-system level tasking.
• →Drive execution to the planned budget and schedule.
• →Identify and manage project risks and opportunities.
• →Lead medium sized teams to success.
• →Coach, review, and delegate work to junior engineers.
• →Serve as a subject-matter expert within discipline.
• →Lead internal and external technical reviews.
• →Support customer interactions and relations.
• →Contribute to product and technology roadmaps
• →Make improvements to processes, systems or products to enhance overall performance
• →Engage in personal technical growth and facilitate technical growth in peers and junior engineers.

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This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm