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Internship in Semiconductor Packaging 80 - 100% (f/m/d)

OtherInternship
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Quick Summary

Overview

Location:Baden-Daettwil, Aargau,

Technical Tools
OtherInternship
Baden-Daettwil, Aargau, Switzerland

2026-07-22

HITACHI ENERGY LTD

Administration & Facilities

Full time

No

The Research Team Semiconductor Packaging and Reliability Engineering at our Swiss Power Grids Research Center is looking for an intern student with expertise in electrical engineering, physics, materials and analytical methods to contribute to the development of novel semiconductor power modules for e-mobility and grid applications. The intern will interact with a dynamic and multidisciplinary team that will supervise and guide the project. If you have a strong technical background, motivation to develop innovative solutions, and you are goal-oriented, this is your opportunity to contribute in building a stronger and more sustainable energy future. The duration of the internship is six months.

Responsibilities

~1 min read
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    Support technology development and research activities in the development of semiconductor power modules, i.e. process development and prototype manufacturing in a state-of-the-art cleanroom

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    Perform accelerated lifetime testing, characterize modules before and after aging, supervise the test setup

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    Perform first steps of the root cause analysis (X-ray, SAM, cross section etc.) and concisely document the test results

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    Perform electromagnetic and thermal infinite element simulations to validate design features

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    Create CAD designs of power modules in close collaboration with the team, find creative and efficient solutions to meet demanding and sometimes conflicting requirements

  • Currently pursuing a M.Sc. degree in material science, electrical engineering, physics, chemistry or similar discipline (advanced B.Sc. or M.Sc. degree); official enrollment essential

  • Experience in laboratory work and know-how in experimental methods using a wide range of advanced materials characterization techniques

  • Solid programming skills (e.g. LabVIEW, Python, Matlab etc.)

  • Experience with finite element modeling advantageous (ANSYS Q3D, COMSOL)

  • Know-how in data analysis tools and statistics is advantageous

  • Enthusiastic, self-motivated mindset and ability to work independently as well as highly conscientious individual with keen sense of responsibility

  • Fluency in written and spoken English and good communication and technical writing skills

  • Motivated and eager to learn more and become part of a multidisciplinary research team focused on innovation

We are a technology-driven company with a strong focus on innovation, continuous improvement, and sustainable manufacturing. We offer flexible working conditions, dedicated mentorship, and a supportive, inclusive environment where you can grow personally and professionally – empowering you to thrive while balancing life and work.

Location & Eligibility

Where is the job
Switzerland
On-site within the country
Who can apply
CH

Listing Details

First seen
September 28, 2026
Last seen
September 28, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
56%
Scored at
September 28, 2026

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Internship in Semiconductor Packaging 80 - 100% (f/m/d)