Packaging Module Development Engineer

• Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization.
• CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process.
• Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle.
• Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization.
• Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
• Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

• BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
• Research and Development background from MSc/PhD is preferred.
• 5 years working experience in electronic packaging AND/OR development experience is preferred.
• Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.
• Excellent influencing, written and verbal communication skills.
• Strong data analysis capabilities and problem solving skills.
• Proactive and positive approach towards challenges.
• Able to work under tight timelines and schedules, and perform under pressure.

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