Package, Assembly, Test (PAT) Team Lead

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

• We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

• →Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production. 

• →Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies. 

• →Working with HQ team to support device packaging process improvement with Cp and Cpk increase.  

• →Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin. 

• →Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.       

• →Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and system reliability tests.  

• →Write technical documentation for test implementation, reports, and present results to internal and external stakeholders. 

• →Intime make technical and project decision. 

• →Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures 

• →Manage and expand the Asia operation team when needed.   

• Minimal requirement is a bachelor's degree with 12 years of experience.  

• Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.    

• Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.   

• A fast learner is a must. 

• Good work ethics and maintaining the company’s confidential information are a must. 

• A higher degree with more experience is highly desired. 

• Experience on optoelectronic device tests such as those for optical engines in pluggable modes and pluggable modules is a plus. 

• Experience and knowledge of silicon photonic devices and IIIV CoC reliability is a huge plus. 

• Experience of the setup and implementation of tests for NPI and volume production is a big plus.  

• Experience in the process of automation and test automation is a plus.  

• Data analysis experience such as JMPs is a plus;

Benefits (subject to location and local regulations)

• Competitive salary and equity 
• Comprehensive medical, dental, and vision coverage 
• 401(k) retirement plan 
• Flexible vacation and time-off policy 
• Collaborative, fast-paced, and inclusive work environment 
• Opportunity to work on cutting-edge technologies with a highly cross-functional team