lyte~6h ago
New
New
Packaging Design and SI/PI Engineer
OtherEngineer
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Quick Summary
Requirements Summary
Siwave, HFSS, APD, or similar Maintain company confidential information are a must Preferred Qualifications Master’s degree with more experience is highly
Technical Tools
OtherEngineer
- About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
About the Role
~1 min read- We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.
Responsibilities
~1 min read- →Own the design and layout of our micro-electronic package, the heart of our LyteCore system
- →Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
- →Perform signal/power integrity simulation to optimize our package & system performance
- →Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
- →Project tracking weekly.
- →Write technical reports and present results.
- →Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.
Requirements
~1 min read- Minimal requirement is a bachelor's degree with 5 years of experience
- Fluent in English communication, able to collaborate with teammates in different time zones
- Experience in substrate design and packaging technology
- Experience in signal and power integration simulation and interpretation of the results
- Experience in EDA tools: Siwave, HFSS, APD, or similar
- Maintain company confidential information are a must
- Master’s degree with more experience is highly desired
- Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
- Experience with hands-on testing of electronic packages/systems.
- Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills are desired eg. python, or C++
- Describe the experience and attributes of the ideal candidate
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
Location & Eligibility
Where is the job
Singapore
On-site within the country
Who can apply
SG
Listing Details
- First seen
- September 26, 2026
- Last seen
- September 26, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 52%
- Scored at
- September 26, 2026
Signal breakdown
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External application
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