Senior Signal/Power Integrity Engineer

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

• We are seeking Senior Level PCB Signal/Power Integrity Engineer to own and execute high-speed Signal Integrity (SI) and Power Distribution Network (PDN) simulations and validation.

• →Collaborate with multi-disciplinary engineers (EE, System and Package) to define electrical performance related to SI, PI, EMI and EMC
• →Develop engineering test plans and methodologies for SI and PI simulation, including modelling of power networks, parasitic, impedance-controlled transmission lines, vias, connectors, sockets, and system components.
• →Validate power and signal integrity in laboratory settings, ensuring alignment with design specifications and simulation outcomes.
• →Analyze simulation and lab data to identify design issues and propose corrective actions.
• →Ability to support multiple projects concurrently, ensuring timely completion of design and validation tasks.

• Bachelor's degree in Electrical Engineering, or related field with at least 8 years of experience
• Proficiency with Ansys SIwave, Ansys HFSS, Altium 365, Cadence Sigrity, and Keysight ADS
• Experience design in of complex SoCs, PMICs, mixed-signal analog/digital designs for sensors and high-speed interfaces such as LPDDR4/4x, MIPI, 10G Ethernet and PCIe Gen 2/3
• Experience with system-level timing, loss budget including silicon, package and board impairments
• Experience with lab measurements, debugging, and SI correlations using oscilloscopes, spectrum analyzer, VNA and TDR
• Fluent in English communication, able to collaborate with teammates in different time zones
• Ability to travel internationally as needed
• Maintain company confidential information are a must 

 Preferred Qualifications

• Master’s degree with more experience is highly desired
• Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
• Nice to have experience in substrate design and packaging technology
• Familiar with some of the device packaging processes such as die attach, flip chip, and wire bonding.
• Data analysis experience such as JMPs is a plus; Excel is OK.
• Programming and software maintenance skills are desired e.g. python, or C++

Benefits (subject to location and local regulations)

• Competitive salary and equity 
• Comprehensive medical, dental, and vision coverage 
• 401(k) retirement plan 
• Flexible vacation and time-off policy 
• Collaborative, fast-paced, and inclusive work environment 
• Opportunity to work on cutting-edge technologies with a highly cross-functional team