Director, Advanced Packaging Technology Development

Req. ID: JR112114 Director, Advanced Packaging Technology Development Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Director of Process Development in Advanced Packaging Technology Development (APTD) within Micron, you will provide strategic and technical leadership for the development and deployment of advanced packaging assembly processes enabling next-generation memory products. You will collaborate with internal and external stakeholders to define and execute technology development strategies aligned with organizational and business objectives. Your team will be responsible for developing scalable, manufacturable, and cost-effective assembly processes that deliver industry-leading performance, quality, yield, and reliability. You will drive innovation across advanced packaging technologies including 2.5D, 3DIC, hybrid bonding, wafer-level and panel-level packaging, advanced interconnect solutions, and emerging assembly platforms. You will lead process development from concept through technology qualification, productization, and high-volume manufacturing transfer while ensuring alignment with Technology Development business processes. In this role, you will develop organizational capability through leadership coaching, talent development, succession planning, and strategic workforce planning. You will establish performance metrics, drive continuous improvement initiatives, and provide organizational leadership in developing department strategies, technology roadmaps, and cross-functional execution plans. Responsibilities include, but are not limited to, the following: Technology Strategy and Roadmap Development * Develop and communicate advanced packaging process technology strategies aligned with Micron's long-term product and technology roadmap. * Define process development roadmaps for next-generation packaging platforms. * Evaluate emerging assembly technologies, materials, and equipment solutions to identify future competitive advantages. * Understand market, product, and technology trends and translate them into executable development strategies. * Influence organizational investment decisions through data-driven technical recommendations. Process Technology Leadership * Establish strategic and long-term technical objectives for assembly process development organizations. * Drive innovation in die attach, hybrid bonding, thermocompression bonding, molding, underfill, substrate assembly, singulation, and related packaging processes. * Lead development of scalable manufacturing solutions for advanced packaging technologies. * Champion process architecture decisions balancing performance, manufacturability, cost, reliability, and cycle time. * Drive breakthrough solutions for challenging yield, reliability, and process integration problems. Product Development and Manufacturing Readiness * Lead process development activities from concept through qualification and manufacturing transfer. * Ensure development projects meet technology milestones, quality expectations, and business objectives. * Drive manufacturability improvements through process optimization and design enablement. * Ensure process capability, yield targets, cost objectives, and reliability requirements are achieved. * Establish development methodologies, best practices, and qualification strategies. Cross-Functional Leadership * Represent APTD Process Development in company-wide technical and business initiatives. * Partner with Process Integration, Design, Product Engineering, Reliability, Manufacturing, Procurement, Quality, and Supply Chain organizations. * Develop strategic partnerships with equipment and material suppliers. * Lead cross-functional teams in resolving complex technical and operational challenges. * Influence internal and external stakeholders without direct authority. Organizational Leadership * Build and develop a high-performing technical organization. * Create a culture focused on innovation, collaboration, accountability, and continuous improvement. * Establish succession plans and organizational capability roadmaps. * Mentor managers, technical leaders, and emerging talent. * Drive employee engagement, inclusion, and leadership development initiatives. Business Impact and Execution * Ensure critical deliverables, milestones, and business objectives are achieved. * Guide effective utilization of personnel, capital, and equipment resources. * Drive productivity improvements, cycle-time reduction, and cost optimization initiatives. * Make decisions that directly impact product competitiveness and organizational success. * Monitor and communicate key performance indicators to senior leadership. Continuous Improvement and Growth * Apply Artificial Intelligence to promote adoption of new technologies, data science methodologies, and advanced analytics. * Foster a growth mindset within the organization. * Drive continuous improvement in process development methodologies and execution efficiency. * Encourage cross-functional learning and knowledge sharing. * Qualifications and Skills Experience * Minimum 12 years of semiconductor industry experience with at least 5 years in advanced packaging technology development. * Minimum 5 years of leadership experience managing managers and/or large technical organizations. * Demonstrated success developing and qualifying advanced packaging technologies from concept to manufacturing. * Experience working with global teams and external technology partners. Technical Expertise * Strong knowledge in one or more of the following areas: 2.5D and 3D packaging technologies; hybrid bonding (D2W, W2W, C2W); HBM and heterogeneous integration; advanced assembly processes and materials; wafer-level packaging and fan-out technologies; reliability engineering and qualification methodologies; semiconductor manufacturing equipment and process control; yield improvement and failure analysis; and process characterization, DOE, and statistical methodologies. Data and Analytical Skills * Excellent data extraction, analytics, and visualization skills. * Experience with JMP, Python, R, SQL, or equivalent analytical tools. * Strong understanding of process capability, statistical process control, and experimental design. * Ability to translate data into actionable technical and business decisions. Leadership Competencies * Proven ability to lead large and diverse organizations. * Strong strategic thinking and technology vision. * Excellent stakeholder management and influencing skills. * Ability to navigate ambiguity and drive execution under tight timelines. * Outstanding verbal, written, and executive presentation skills. * Strong customer and product focus. * Demonstrated ability to build effective partnerships across global organizations. Education * MS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Chemistry, Computer Engineering, or a related technical field. Recommended Micron-Specific Scope The following expectations may be retained when the role is specifically scoped to Package 3DI Assembly and next-generation HBM enablement: * Own the Advanced assembly technology roadmap. * Lead supplier co-development strategy across key equipment and material partners. * Drive technology transfer across Taiwan, Singapore, and Boise. * Advance AI enabled process optimization and intelligent manufacturing initiatives. * Lead capital strategy and development-equipment investment planning. * Ensure scalable manufacturing readiness for HBM4E, HBM5, and next-generation 3D packaging platforms. Job Profile(s): Product Development Manager 3 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.