IC Package Design Engineer

## Company: Qualcomm Semiconductor Limited ## Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Role Overview We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design activities across complex semiconductor product development programs. This role emphasizes program execution, cross‑functional coordination, and delivery predictability, supporting package design efforts from early feasibility and design planning through tapeout and manufacturing readiness. The engineer will collaborate closely with package designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams to ensure alignment, issue tracking, and timely delivery of package milestones. EDA tools and automation are used primarily as enablers of execution, while the core focus of this role is on driving clarity, managing dependencies, and reducing execution risk. Key Responsibilities Program Execution & Coordination (Primary Focus) * Support execution of IC package design programs from early design planning through tapeout and post‑tapeout support. * Develop and maintain execution plans, schedules, task lists, and milestone trackers. * Track risks, issues, dependencies, and action items across package design, verification, and manufacturing activities. * Drive action item follow‑up, escalation, and closure with clear ownership and timelines. * Prepare and deliver status updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders. * Support design reviews and execution checkpoints by coordinating inputs, capturing outcomes, and tracking follow‑up actions. * Use project and program management tools (e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status. Cross‑Functional & External Engagement * Coordinate across Package Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment. * Work closely with Package Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations. * Interface with New Product Introduction (NPI) teams to support package readiness for qualification, ramp, and high‑volume manufacturing. * Partner with Substrate Engineering & Technology teams to track substrate development, availability, risks, and schedule alignment. * Engage with OSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment. * Coordinate with EDA and tooling teams to ensure design flows and tools are ready to support program needs. Design, EDA & Process Enablement (Supporting / Enabling Role) * Use existing package design flows, EDA tools, reference methodologies, and execution checklists to support program execution. * Draft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle. * Develop clear, structured documentation describing: * Package design and execution workflows * Design release and handoff steps * Readiness checks and acceptance criteria * Common issues, failure modes, and escalation paths * Translate complex technical activities into repeatable, well‑defined process steps that can be consistently followed across teams. * Support EDA and design‑flow issue triage, coordinating with subject‑matter experts and tool owners as needed. * Apply light scripting or automation where helpful to support reporting, consistency checks, or process enforcement. * Capture lessons learned and best practices and incorporate them into updated process documentation and workflows. Required Skills & Experience Program & Execution Skills (Core) * Experience supporting complex, cross‑functional engineering programs. * Strong organizational skills with the ability to manage multiple workstreams in parallel. * Experience using project / program management tools, including: * Execution dashboards * Milestone and dependency trackers * Gantt charts or schedule views * Action‑item and risk tracking tools * Comfortable driving execution in matrixed organizations without direct reporting authority. * Strong written and verbal communication skills. Technical Context (Enabling) * Familiarity with IC package development lifecycles and execution flows. * Working knowledge of IC package design, layout, integration, or manufacturing concepts. * Exposure to package design or EDA tools such as: * Cadence APD / SIP * Cadence Innovus / Virtuoso * Mentor Xpedition * Valor and RAVEL * Scripting or automation experience (e.g., Python, TCL) is a plus but not required. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. 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