Process Integration Engineer

Key Responsibilities * Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies * Translate device architectures and design layouts into robust, manufacturable process flows across development and pilot manufacturing * Drive C&F activities, including rapid proof-of-concept and prototyping builds * Define and track critical process parameters and integration metrics; partner with module owners to optimize unit processes * Own end-to-end integration flow execution, including process definition, build scheduling, risk assessment, and readiness * Drive yield improvement, SPC, and CIP across complex fabrication flows * Conduct optical, electrical, and tolerance analyses to improve device efficiency, scalability, and manufacturability * Collaborate cross-functionally with process engineering, product development, design, and production teams to accelerate technology development * Engage with external vendors, partners and customers to support technology development, material selection, and process scaling Minimum Qualifications * Ph.D. in Electrical Engineering, Materials Science, Physics, or related discipline (Master’s degree with relevant industry experience will be considered) * Strong experience in semiconductor process integration in leading fab / foundry * Solid understanding of semiconductor unit processes including lithography, etch, thin film deposition, metallization, implant, CMP, etc. * Strong experience in yield analysis, metrology, and SPC implementation * Experience with simulation and design tools, such as: Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, ANSYS * Proven ability to work effectively in matrixed, cross-functional teams Preferred Qualifications * Experience in photonic devices, co-packaged optics (CPO), or optical interconnect technologies * Background in advanced packaging and heterogeneous integration Key Competencies * Demonstrated depth in building, debugging, and optimizing device integration flows. * Strong innovation mindset with the ability to develop novel, out-of-the-box integration solutions to complex technical challenges. * Proven ability to influence and align stakeholders without direct authority across diverse functional teams. * Clear and structured communication of complex integration challenges, trade-offs, and solutions to both technical and non-technical audiences. * Strong discipline in process documentation, change management, and data-driven decision-making ## Qualifications ### Education: Bachelor's Degree ### Skills ### Certifications: ### Languages: ### Years of Experience: 7 - 10 Years ### Work Experience: ## Additional Information ### ### Shift: 10-Day 8-Hr (United States of America) ### ### Travel: Yes, 10% of the Time ### ### Relocation Eligible: Yes ### Referral Payment Plan: None U.S. Salary Range: $147,000.00 - $202,500.00 The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.