Senior Engineer II, Process Engineering (PECVD)

As a Senior Engineer II, Process Engineering (PECVD) at ASM Korea, you will play a key role in developing, optimizing, and supporting advanced PECVD processes for leading semiconductor customers.
This role is based in Korea, with primary responsibility for supporting Japan-based customers and projects, requiring strong execution capability, deep process understanding, and excellent communication skills in a global environment. You will work closely with customers, field, and global R&D teams to enable high‑volume manufacturing and next‑generation device applications.

• →Develop, optimize, and support PECVD processes for dielectric and functional thin films (including SiO, SiC) for logic, memory, analog, power, and MEMS applications.
• →Design, execute, and analyze complex experiments using DOE and RSM, and interpret advanced process and materials characterization results.
• →Drive process transfer, customer demonstrations, and high‑volume manufacturing (HVM) support.
• →Troubleshoot process and equipment issues through hands‑on engagement and structured problem‑solving methodologies.
• →Collaborate with global R&D, field service, and marketing teams to define customer requirements and deliver robust process solutions.
• →Produce and present technical documentation, internal reports, and customer-facing materials, ensuring clarity and execution readiness.

• Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field.
• Hands‑on experience with PECVD or related thin film deposition technologies (e.g., ALD, PEALD, CVD, Epitaxy).
• Strong understanding of thin film materials and semiconductor process integration.
• Experience with materials characterization techniques such as XPS, SIMS, SEM, TEM, AFM, XRD, ellipsometry, or equivalent.
• Ability to work independently in complex, execution‑driven environments and manage multiple technical priorities.
• Fluent English communication skills required for daily collaboration with global and Japan-based stakeholders.
• Willingness to travel to Japan as required to support projects.

• PhD degree preferred, especially with research or industry experience in PECVD process development.
• Direct experience with SiO and/or SiC film development for advanced device applications.
• Strong background in high‑volume manufacturing (HVM) support and customer‑facing process execution.
• Ability to bridge process technology, equipment behavior, and customer requirements effectively.
• Japanese language proficiency is a strong plus.
• Demonstrated ability to author technical papers, contribute to intellectual property, or present to technical audiences.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.