Senior / Principal Engineer, Software Engineering
Quick Summary
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next,
As a Senior Principal Engineer in Software Engineering, you will shape the software that directly powers ASM’s advanced packaging and hybrid bonding equipment. Your work will have immediate, visible impact on highly complex semiconductor systems, combining robotics, motion control, thermal systems, and process intelligence. In this role, you will lead software architecture, roadmap definition, and execution across multiple products while growing strong engineering teams and influencing global software strategy.
Responsibilities
~1 min read- →Define and own software development plans and roadmaps for advanced packaging solutions, delivering software across multiple hybrid bonding products in parallel.
- →Lead end‑to‑end software development with a strong focus on first‑time‑right quality and robust release execution.
- →Drive software architecture decisions that support long‑term business, scalability, and product evolution.
- →Plan, manage, and execute multiple software baselines, ensuring on‑time delivery across complex development cycles.
- →Collaborate closely with software quality teams to embed quality throughout the development lifecycle.
- →Work cross‑functionally with process engineering, hardware engineering, and system integration teams to deliver tightly integrated equipment software.
- →Partner with global software engineering leaders to align on software strategy, best practices, and technology direction.
- →Measure, maintain, and continuously improve internal customer satisfaction.
- →Build, mentor, and grow a strong team of software engineers, fostering technical excellence, ownership, and collaboration.
- →Promote disciplined software baseline management, build management, and version control practices.
- Bachelor’s or Master’s degree in Computer Science or a related field.
- Minimum 10 years of experience in software development and software baseline management.
- Experience in the semiconductor process equipment industry.
- Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
- Strong hands‑on software development expertise in C++.
- Proven experience with customer‑oriented software baseline management and release planning.
- Solid background in modern software technologies and development practices.
- Demonstrated ability to drive software architecture aligned with long‑term business needs.
- Strong ownership mindset with proactive leadership and a customer‑oriented approach.
- Ability to define clear priorities, set ambitious yet realistic goals, and deliver results.
- Experience managing projects, schedules, activities, and resources effectively.
- Hands‑on experience with Jira, build management tools, and Git version control.
- Experience working in fast‑paced, customer‑driven, and rapidly evolving environments.
- Ability to handle multiple concurrent projects while meeting demanding timelines.
- Strong prioritization skills across complex and competing technical demands.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
Listing Details
- First seen
- March 27, 2026
- Last seen
- April 24, 2026
Posting Health
- Days active
- 28
- Repost count
- 0
- Trust Level
- 31%
- Scored at
- April 25, 2026
Signal breakdown
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