Field Application Engineer

 

 

A career-defining opportunity rarely offers all of the following:

 

Direct connection to the mission.  Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact. 

Growth beyond a single role.  At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization. 

Work on problems that matter.  Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.  Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us. 

This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications.  

This position offers the opportunity to work closely with hyperscalers, ODMs, OSATs, and foundries to influence the adoption of cutting-edge thermal solutions in next-generation AI and HPC silicon and data center systems.  

Join us to solve one of the most critical challenges facing AI Infrastructure and High Performance Computing – thermal management!   

• Act as the primary technical point of contact for ODM, OSAT, and Foundry customers, leading the on-site technical integration of our liquid-metal TIMs during early and mid-stage engagements. 
• Support customer assembly and testing trials, locally coordinating mechanical and reliability testing to validate mass production feasibility, while troubleshooting technical issues in real-time with internal teams. 
• Work closely with the business development team to uncover and document precise customer technical requirements, including geometric, load, assembly constraints, thermal budgets, and reliability standards. 
• Capture customer feedback and synthesize technical insights to support the US-based R&D team in continuous product improvement and roadmap planning. 
• Prepare and deliver critical technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes. 
• Document designs for customer coordination and lead local efforts to fabricate provisions and mockups (either internally or externally) to ensure customer schedules are met. 

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.  
• CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation.  
• 3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company.  
• Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.).  
• Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.  
• Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.  
• Experience with design and fabrication of elastomeric materials is a plus.  
• Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus. 
• Bilingual proficiency in Mandarin and English (both written and spoken) to effectively act as the primary liaison between customers and our US-based engineering teams. 

Competitive Compensation: Salary and benefits package fully compliant with the Taiwan Labor Standards Act (LSA). 

Health & Security: Comprehensive coverage including mandatory enrollment in Taiwan’s National Health Insurance (NHI) and Labor Insurance systems. 

Culture & Integration: Full integration into the Boston Materials global engineering team, including direct access to HQ leadership and internal product development resources. 

Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.