Micro-Electronics Assembler 2nd Shift

Performs standard assembly, die bonding, wire bonding, and installation steps for the components for microwave assemblies.

Typical duties and requirements are not meant to be all encompassing but a general framework of requirements/responsibilities for:

• →Perform basic mechanical assembly of channel amplifiers, linearizers, and other precision microwave parts and provide MIC assembly technical support per documented work instructions with or without assistance.
• →Mechanical assembly consisting of housing fabrication for HI-REL channel amplifiers.
• →MIC assembly consisting of brazing, die attach, wedge-wedge bonding and gap welding.
• →Responsible for effectively and efficiently setting up and operating assembly and/or equipment as required to manufacture and process through final acceptance and delivery.
• →Support test for electrical changes being performed for tuning purposes.
• →Familiar with brazing, die attach, wedge-wedge bonding and gap welding processes.
• →Ability to work under a microscope for extended periods of time
• →Interpret job routers, written instructions, wiring diagrams and schematic drawings for assembly of electronics.
• →Perform a variety of inspections to ensure assemblies meet or exceed standards
• →Disassembling, modifying, reworking, re-assembling assemblies and subassemblies according to specifications and under simulated conditions with or without supervision.
• →Must continuously meet/exceed production schedules and deadlines according to quality standards.
• →Maintain logs, paperwork, and forms accurately consistent with company policy and practices.
• →Additional Duties as assigned by supervisor or manager

• 0-5 years in a high-volume, microwave or other high technology experience.
• At least 1 year experience with electronic and mechanical assembly, soldering, brazing, die attach, wedge-wedge bonding and gap welding.
• IPC J-STD-001, IPC-A-610, MIL-STD-2000, NASA-STD-8739.3, or equivalent
• Must be able to read and understand mechanical drawings and detailed work instructions
• High School Diploma or GED Required

• IPC J-STD-001, IPC-A-610, MIL-STD-2000, NASA-STD-8739.3, or equivalent

• Ability to work under a 60x microscope for extended periods of time
• Specific abilities for manual dexterity, coordination, and stamina
• Strong analytical and problem-solving skills
• Strong communication skills: interpersonal, oral, and written
• Ability to effectively manage multiple tasks/projects
• Ability to work on a team as well as independently