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Eliyan6mo ago

Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Bay Area · Bay AreaFull-timesenior
OtherPackage & Si/Pi
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Quick Summary

Overview

Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team.

Technical Tools
OtherPackage & Si/Pi
Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F
  •  Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
  • Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
  • Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
  • Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawk?SC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
  • Create hierarchical compact macro models (CMM) and reduced-order thermal models for early?stage design optimization
  • Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
  • Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
  • Support customer engagements with technical analysis and present findings to stakeholders
  •  
    • Education:
  • PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
  • Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
    •  
    Technical Skills: 
  • Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
  • Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTL?to-GDSII flows
  • Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
  • Knowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design
    •  
    Domain Expertise:  
  • Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal co?simulation
  • Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
  • Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
  • Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs 
  • Familiarity with machine learning applications in EDA and design optimization
  • Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
  • Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation
  • Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
  • Excellent communication skills to present complex technical concepts to diverse audiences
  • Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
  • Self-motivated professional who thrives in fast-paced environments with minimal supervision
  • Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
  • Results-oriented engineer delivering high-quality work to enable product milestones on schedule

    • Listing Details

    Posted
    October 20, 2025
    First seen
    March 26, 2026
    Last seen
    April 22, 2026

    Posting Health

    Days active
    26
    Repost count
    0
    Trust Level
    23%
    Scored at
    April 22, 2026

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    Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
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