Espace14mo ago

Senior Hardware Engineer - Signal Integrity and Thermal Analysis Design

United States·SaratogaFull-Timesenior

OtherHardware Engineer

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Quick Summary

Overview

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

Technical Tools

OtherHardware Engineer

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems.

We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life.

We are seeking a highly skilled and experienced Senior Hardware Engineer with expertise in signal integrity and thermal analysis to join our design team. This individual will be responsible for designing high-performance hardware schematics, running signal integrity simulations, and performing thermal analysis on printed circuit board (PCB) designs. The ideal candidate will be well-versed in modern PCB design methodologies, simulation tools, and thermal management techniques to ensure optimal performance, reliability, and manufacturability of the final product.

Hardware Design: Lead the development of high-speed, high-performance hardware schematics for PCBs, ensuring the designs meet functional, electrical, and mechanical specifications.

Signal Integrity: Perform detailed signal integrity analysis and simulations (including but not limited to reflection, crosstalk, impedance matching, and transmission line effects) to ensure robust high-frequency signal transmission and minimal noise interference.

Thermal Analysis: Conduct thermal simulations and analysis on PCB designs to assess and mitigate heat generation and ensure efficient thermal management. Optimize component placement and design layout to enhance heat dissipation.

Simulation & Tools: Utilize industry-standard tools such as SPICE, HyperLynx, CST, Ansys, or similar for signal integrity and thermal simulations to validate design performance before physical prototyping.

Collaboration: Work closely with cross-functional teams, including software engineers, mechanical engineers, and manufacturing teams, to ensure that the hardware design integrates seamlessly into the overall system.

Design Optimization: Recommend and implement design changes based on simulation results to improve the signal integrity and thermal performance of the product.

Documentation: Provide detailed design documentation, simulation reports, and analysis results for internal review and manufacturing handoff.

Problem Solving & Troubleshooting: Investigate and resolve design-related issues during the validation and testing phase, including signal and thermal anomalies.

Experience: Minimum of 5 years of hands-on experience in hardware design, signal integrity analysis, and thermal simulation, ideally within a high-performance or embedded systems environment.

Skills:

Strong expertise in schematic capture and PCB design tools (e.g., Altium, OrCAD, Cadence).

Proficiency in signal integrity analysis tools (e.g., HyperLynx, SIwave, ADS, CST).

Experience in performing thermal analysis using tools such as Ansys Icepak, FloTHERM, or similar.

Solid understanding of PCB manufacturing processes and design for manufacturability (DFM).

Familiarity with high-speed circuit design principles, including impedance control, differential pairs, and high-frequency components.

Problem-Solving: Excellent analytical and problem-solving skills with the ability to independently drive design improvements.

Communication: Strong written and verbal communication skills with the ability to present complex technical concepts to non-technical stakeholders.

Team Player: Ability to work in a fast-paced, collaborative environment and contribute to multiple projects simultaneously.

Experience with multi-layer high-speed PCB designs.

Familiarity with FPGA and microcontroller and high-speed memory interface designs.

Knowledge of advanced thermal management techniques, such as heat sinks, vias, and thermal vias.

Experience with simulation automation and scripting is a plus.