Yield and Integration Engineer
Quick Summary
Be visionary Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability.
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Under the supervision of the Detector Yield and Data Engineering Manager, collects, tracks and analyzes process and metrology data from a variety of sources to inform and guide team’s design and process yield improvement activities. A significant aspect of this position also includes direct involvement in device failure analysis. Will need to collaborate with team members and other contributors across the spectrum of relevant disciplines and levels of authority. Ability to work effectively in a high performance team environment, including demonstrated strong interpersonal and communications skills. A flexible, self-motivated, results oriented mindset is essential.
In support of data mining, analysis and reporting role, ideal candidate will have some experience in:
- Semiconductor wafer processing
- Programming skills in: Python, Matlab, R, JMP, or similar
- SQL database query experience
- Statistical Process Control (SPC)
In support of Failure Analysis and yield improvement, ideal candidate will have some experience in:
- Structured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc.)
- Design of Experiments (DOE/ANOVA)
- Optical microscopy
- SEM/FIB
- Profilometry, ellipsometry, X-Section, wafer stress
- Other elemental analysis methods (TOF-SIMS, EDX, & Auger)
- Other fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace)
Other desired experience/knowledge areas:
- Wafer processing (photo, etch, dep, clean, CMP, inspection, etc.)
- Vacuum technology and equipment
- Infrared Imaging
- Hermetic packaging (solder, seam seal, wirebond, WLP, die attach, leak testing, etc.)
Required:
- BS in engineering or a science, M.S. preferred
- 2+ years as a Process, Design, Quality or Manufacturing Engineer
- Ability to work in cleanroom environment.
What We Offer
~1 min read
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
Location & Eligibility
Listing Details
- First seen
- September 30, 2026
- Last seen
- September 30, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 56%
- Scored at
- September 30, 2026
Signal breakdown
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