Principal FA Technician

#WeAreIn for jobs that impact everyone's life. Driving continuous improvement - ready to make quality a culture? As a Principal FA Technician on our Quality & Excellence team uncover the root causes behind every single error, drive transformational improvements, and implement forward-thinking solutions to ensure our products exceed the highest standards of quality, reliability, and performance. Are you in? Your Role Key responsibilities in your new role * Perform parametric testing on power devices under high-voltage and high-current conditions using specialized testers(e.g., curve tracers, dual-pulse testers) to identify leakage currents, threshold voltage shifts, or on-resistance (R DS(on) /Ron) ) anomalies * Utilize Lock-in Thermography (LIT) and Dynamic IR Thermography to locate hot spots and leakage paths under operating conditions, which is critical for identifying short circuits in high-power modules * Perform fine-pitch electrical probing on bare die(BCD/Trench FET/GaN) to isolate failed sub-circuits or power loops within complex multi-chip power modules * Analyze flip chip on laminate via alignment, die stacking and die attach interfaces, solder connection voiding and solder ball formations in large-area LGA substrate power packages. Detect delamination between the die attach, and chip embedded PCB substrates * Prepare high-quality cross-sections of power modules to inspect die attach thickness, solder joint integrity, and interface quality between silicon dies and substrates * Execute precise mechanical or chemical decapsulation of power modules and power stages (e.g., chip embedded LGA substrates, multi-chip QFN) without damaging the die, embedded PCB vias and solder connections * Use Focused Ion Beam milling to expose specific layers within the power device structure for SEM imaging, particularly for identifying electromigration, gate oxide punctures, or substrate cracks in silicon and trench FET devices * Analyze devices that have exceeded Safe Operating Area (SOA) limits, identifying thermal runaway, secondary breakdown, or latch-up mechanisms * Perform specialized analysis (e.g.,TEM, FIB-SEM) to identify ESD-induced damage to gate oxides or parasitic thyristors in power switches * Investigate failure modes related to environmental stress, such as chloride ion corrosion, flux residue effects, or dendritic growth in humid environments. Specialize in failure mechanisms unique to BCD silicon, vertical trench FET, and Gallium Nitride (GaN), including high-voltage breakdown, gate charge anomalies, and interface states * Methodology Development & Technical Leadership SOP Development: Create and optimize Standard Operating Procedures(SOPs) for handling internal a and external customer samples, ensuring safety and preventing sample introduction of artifacts * Oversee the calibration and preventive maintenance of high-power test setups, thermal imagers, and precision polishing equipment * Author detailed failure analysis reports that clearly link physical evidence to electrical failure modes, providing actionable recommendations for design or process improvements. * Ensure strict adherence to safety protocols when handling power modules and test equipment. Manage the safe handling and disposal of chemicals used in decapsulation, etching, and cleaning processes (e.g., strong acids/bases) * Ensure all FA activities comply with ISO/TS16949 (automotive), IATF 16949, or ISO 9001 standards, and maintain audit-ready documentation Your Profile Qualifications and skills to help you succeed * Associate’s Degree or Bachelor’s Degree in Electrical Engineering (EE), Materials Science, Physics, Chemistry, or Mechanical Engineering. Preferred: Master’s Degree in Materials Science or Electrical Engineering with a focus on semiconductor reliability or power electronics * Alternative: High School Diploma/GED with 10+ years of progressive, documented experience in semiconductor failure analysis, specifically in power devices * Minimum 8–10 years in Failure Analysis. Domain Specific: At least 5 years specifically focused on Power Semiconductors Industry Background Experience in one or more of the following industries is highly desirable: Automotive Electronics (EV/Hybrid Vehicle Inverters, OBC, DC-DC). Industrial Drives (VFDs). Renewable Energy (Solar/Wind Inverters). Consumer Power Supplies (Server PSUs, EV Chargers) * The ideal candidate possesses deep expertise in non-destructive and destructive physical analysis techniques, with a strong understanding of high-current electrical phenomena * (SME) in wide-bandgap (WBG) technologies and advanced packaging structures, capable of leading complex root-cause investigations and mentoring junior staff in a high-reliability environment (Automotive, Industrial, AI sectors) * Power Device Physics & Reliability Knowledge Device Architecture: Deep understanding of Si Trench MOSFET, and GaNHEMT structure, operation principles, and typical failure mechanisms(e.g., latch-up, secondary breakdown, thermal runaway, gate oxide integrity) * Expert knowledge of power module architectures, including: chip embedded and capacitor embedded substrates, flip chip and die stacking. Advanced technologies: SAC305 and 95/5 SnSb tin-antimony solder alloys, and sintered silver die attach, Chip-on-Board (CoB), Embedded Power, and Wire Bond vs. Sintering vs. Copper Clip interconnects * Ability to mentor junior technicians, define best practices, and lead technical escalations * Analytical Rigor: Meticulous attention to detail; ability to distinguish between sample introduction artifacts and actual failure mechanisms * Strong technical writing skills for detailed FA reports; ability to explain complex physical findings to electrical engineers and customers * Creative thinker who can design custom experimental setups to isolate elusive failure modes * Preferred Certifications & Tools Certifications: Certified Failure Analysis (CFA) or similar industry certification. SO/IEC 17025 internal auditor training. Health & Safety certifications (e.g., OSHA, chemical handling) * Software/Tools: Proficiency with FA image analysis software (e.g., AMETEK Dage, Quorum Technologies, Oxford Instruments). Basic familiarity with data analysis tools (JMP, or Python) for statistical reliability analysis #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon. Driving decarbonization and digitalization. Together. Infineon Technologies Americas Corp., is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, family care status, military or veteran status, marital status, domestic partner status, sexual orientation, or any other basis protected by local, state, or federal laws. Employment at Infineon is contingent upon proof of your legal right to work in the United States under applicable law, verification of satisfactory references and successful completion of a background check and drug test, and signing all your on-boarding documents. In some instances, if applicable, U.S. export control laws require that Infineon obtain a U.S. government export license prior to releasing technologies to certain persons. This offer is contingent upon Infineon's ability to satisfy these export control laws as related to your employment and anticipated job activities. The decision whether or not to submit and/or pursue an export license to satisfy this contingency, if applicable, shall be at Infineon's sole discretion. #LI-MM Infineon Technologies takes data privacy and identity theft very seriously. As such, we do not request personally-identifiable information (PII) from applicants over the internet or electronically. Please kindly refrain from disclosing your PII electronically during the application process or to unauthorized websites that may purport to be Infineon or any of our affiliates. In the United States, it is required to disclose a salary range to applicants. The Wage range that the company expects to pay for a qualified candidate in the United States is: Leominster, MA Minimum of $79,700.00 per year and Maximum of $109,600.00 per year In addition, all employees will be eligible to participate in an incentive plan