118-WW TMG MFG OPS20h ago
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Plasma Equipment Technician - D Shift RFAB
OtherEquipment Technician
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Quick Summary
Key Responsibilities
Improve system performance to achieve process
Requirements Summary
High School diploma/GED 18 years of age or older One of the following: 2 years of semiconductor experience as Technician OR 5 years of non-semiconductor/military Techni
Technical Tools
OtherEquipment Technician
Responsibilities
~1 min read- →Improve system performance to achieve process requirements and eliminate repetitive downs
- →Monitor and analyze all related data to improve and maintain tool performance and address all tool related issues
- →Coordinate supplier service and repairs where needed
- →Prepare the technical report and summary findings and recommending solutions to technical problems
Requirements
~2 min read- High School diploma/GED
- 18 years of age or older
- One of the following:
- 2 years of semiconductor experience as Technician OR
- 5 years of non-semiconductor/military Technician experience
- Ability to work 12 hour compressed work schedule
- Flexible to work day or night shift that will include one weekend shift and holidays
- Proficiency with vacuum systems and troubleshooting
- Vacuum pump operation, leak detection and He leak checking, pressure control systems (gauges, controllers, etc)
- Proficiency with RF systems and troubleshooting
- RF generator operation, forward & reflected power analysis, RF cable and connector maintenance, etc.
- Proficiency with gas delivery systems and troubleshooting
- MFCs, gas boxes, pneumatic valves, etc.
- Proficiency with electrical systems and troubleshooting
- Ability to read & interpret toolset schematics, digital multi-meter proficiency, power/sensor/motor diagnostics, PLC familiarity, robot & robot controller troubleshooting
- Familiar with plasma etch processes and wafer handling procedures
- Mechanical proficiency
- Ability to disassemble and reassemble in a 5S'd, logical, organized manner - follow BKMs where applicable
- Familiarity with hand tools, seal and o-ring replacement, alignments, etc.
- Ability to lift and move materials, equipment, and components weighing up to 50lbs
- Self-driven with ability to identify and resolve issues to improve equipment performance
- Excellent organizational, teaming and troubleshooting skills
- Strong verbal and written communication skills
- Demonstrated strong analytical, critical thinking, and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
- Demonstrated ability to build strong, influential relationship
- Experience with 300mm semiconductor manufacturing equipment, ideally with several key OEMs - AMAT, LAM and TEL
Location & Eligibility
Where is the job
Richardson, United States
On-site at the office
Who can apply
US
Listing Details
- Posted
- June 24, 2026
- First seen
- June 24, 2026
- Last seen
- June 24, 2026
Posting Health
- Days active
- 0
- Repost count
- 0
- Trust Level
- 51%
- Scored at
- June 24, 2026
Signal breakdown
freshnesssource trustcontent trustemployer trust
External application · ~5 min on 118-WW TMG MFG OPS's site
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