118-WW TMG MFG OPS
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Packaging Engineer

MalaysiaMalaysia·Malaccamid
OtherPackaging Engineer
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Quick Summary

Key Responsibilities

Develop new package

Technical Tools
OtherPackaging Engineer

Responsibilities

~1 min read
  • Develop new package requirements and maintaining quality of existing packages for all product groups
  • Define package requirements for product groups and customer requirements
  • Develop new package and process qualification programs.
  • Perform integrity analysis of packages utilizing appropriate tools
  • Perform package characterizations including cost effectiveness studies.
  • Act as a liaison with vendors
  • Maintain product quality while developing and introducing package cost reduction programs
  • Coordinate the introduction of new package processes into production
  • Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies

Requirements

~1 min read
  • Bachelor's degree in Chemical, Material Science, Mechanical, Electrical or other related Engineering degree. Master’s degree a plus.
  • Minimum 5 years of relevant experience
  • Hands-on process engineering experience in AT LEAST ONE of the following technical areas:
    • Option 1: Wafer-to-carrier Temporary Bonding and Debonding (TB/DB) systems, thermal/mechanical bonding processes, and total thickness variation (TTV) control
    • Option 2: Photolithography track processes (polymer spin coating, curing, bake ovens) OR automated wet bench processing (photoresist stripper, polymer cleaning, and glass/silicon wafer cleaning)
  • Experience or involvement in equipment installation, cleanroom hook-up coordination and tool startup/readiness
  • Experience in bump and wafer level processing
  • Initiative-driven mindset with desire to own projects and drive results
  • Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
  • Strong verbal and written communication skills
  • Ability to quickly ramp on new systems and processes
  • Demonstrated strong interpersonal, analytical and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery

Location & Eligibility

Where is the job
Malacca, Malaysia
On-site at the office
Who can apply
MY

Listing Details

Posted
June 24, 2026
First seen
June 24, 2026
Last seen
June 24, 2026

Posting Health

Days active
0
Repost count
1
Trust Level
44%
Scored at
June 24, 2026

Signal breakdown

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118-WW TMG MFG OPSPackaging Engineer