NPI Engineering Intern -  Advanced Package Technology

We are seeking a highly motivated Engineering Intern to support early‑stage research and evaluation of advanced package technology.

This internship focuses on technology surveying, literature analysis, and knowledge synthesis. The intern will conduct a structured review of academic and publicly available industry research to develop a clear, well‑organized overview of the current Package development landscape. The results will support technical discussions and future exploratory R&D work.

This role is ideal for PhD students with a strong background in semiconductor package process, like 3DIC or 2.5D integration, or related research fields who are interested in advanced package beyond the state of the art.

• →Conduct a systematic review of package‑related information from: 
• →Academic journals and conference proceedings
• →Patents and publicly available industry sources
• →Organize and synthesize fragmented information into a structured technical knowledge base
• →Identify key technological trends, including: 
• →Process concepts and material approaches
• →Integration strategies and reported demonstrations
• →Performance targets and extendibility considerations
• →Analyze and summarize major technical challenges and development bottlenecks identified in literature
• →Perform a high‑level scan of early industry and ecosystem signals, such as patents or collaborations
• →Prepare clear documentation and presentations that distinguish evidence‑based insights from areas of uncertainty

• A consolidated and well‑structured technology review report on 3DIC
• Structured summaries of technical trends and key challenges
• Presentation materials suitable for technical discussions and evaluations

• →Hands‑on experience evaluating an early‑stage, next‑generation semiconductor package technology
• →Exposure to how advanced technology concepts are assessed prior to major R&D investment
• →Opportunity to develop strong skills in technical analysis, literature review, and technology scouting
• →Experience working closely with senior engineers and researchers in advanced technology development

• Currently pursuing a PhD degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field
• Fundamental understanding of semiconductor package and/or process integration
• Strong ability to read, analyze, and synthesize technical literature
• Solid written communication skills in English 

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.