USD 30–45/yr

Device Engineering Intern

United StatesUnited States·Bay AreaFull-timeentry
OtherEngineering Intern
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Quick Summary

Overview

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless.

Technical Tools
OtherEngineering Intern
Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

We are seeking a hands-on summer intern to support semiconductor materials preparation and advanced characterization in a highly collaborative lab environment. This role focuses on sample fabrication alongside in-depth analysis to understand material structure and properties, and is rooted in cleanroom experimentation, thoughtful iteration, and a deep understanding of semiconductor materials & device physics. The ideal candidate is curious, self-driven, and motivated by ownership and impact - someone who enjoys working closely with teammates, taking responsibility for device performance, and tackling technical challenges for high-power diamond-based electronics.
 

This position would operate out of our Stanford office and our South San Francisco office.

  • Design and optimize semiconductor materials & associated device structures
  • Collaborate with engineers in the cleanroom to fabricate devices and associated test structures
  • Lead in-depth characterization of devices using techniques such as TEM, SEM/FIB, and XPS, and correlate results to electrical performance
  • Develop and execute sample preparation workflows (e.g., cross-sectioning, FIB lift-out) to enable high-quality characterization
  • Analyze, document, and communicate experimental results to guide process and device improvements
  • Ability to work effectively in a collaborative, inclusive, and accountability-driven team environment, with strong communication skills and a proactive, self-directed approach to work

  • MSc or PhD (in progress or completed) in Materials Science, Physics, Electrical Engineering, or a related field, with experience in semiconductor materials or devices

  • Hands-on experience with semiconductor microfabrication and subsequent materials and/or electrical characterization

  • Understanding of semiconductor device physics, including transport mechanisms, interfaces, and reliability

  • Experience with device or materials characterization and experimental data analysis; familiarity with modeling or simulation tools is a plus

Location & Eligibility

Where is the job
Bay Area, United States
On-site at the office
Who can apply
US

Listing Details

Posted
April 27, 2026
First seen
April 27, 2026
Last seen
May 3, 2026

Posting Health

Days active
5
Repost count
0
Trust Level
56%
Scored at
May 3, 2026

Signal breakdown

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Device Engineering InternUSD 30–45