Senior Staff Engineer Package Technology Soldering

You're responsible to establish and setup new assembly process Die Attach (solder or epoxy dispensing/ stencil printing, die bond, chip soldering) capabilities, support new package development, ramp up, platform extensions, innovations and hands-on equipment setup. Your Role Key responsibilities in your new role 1\. Establish and setup new assembly process Die Attach (solder or epoxy dispensing/ stencil printing, die bond, chip soldering) capabilities, support new package development, ramp up, platform extensions, innovations and hands-on equipment setup 2\. Plan and execute evaluations for unit process development according project targets in term of timeline, quality, cost, competitiveness and manufacturability 3\. Perform process development activities (Process parameters scouting, optimization, verification and Process Freeze) 4\. Support prototype and development samples build 5\. Responsible or support for technical handshake and knowledge transfer to Operations 6\. Drive and liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects 7\. Generate and update relevant documents, eg Process Specification, PFMEA, OJTI, PDR 8\. Be the technical lead for task force and complex problem solving team using Statistical and analytical tools, eg SPC, APC, DOE, 8D, FMEA 9\. Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Failure catalogue, Control Plan, Maintenance checklist Your Profile Qualifications and skills to help you succeed 1\. Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline 2\. At least 10 years of working experience in semiconductor packaging 3\. Prior experience in Map mold, SON, TO, DSO power product development is strongly preferred 4\. Strong hands-on knowledge and skills in Die Attach (solder or epoxy dispensing/ stencil printing, die bond, chip soldering) process 5\. Statistical data analysis, analytical, and problem-solving skills, eg DoE, 8D, DMAIC 6\. Good communication, presentation skills & Microsoft office 7\. Good aptitude for collaboration, negotiation and solution finding 8\. Competent in daily oral & written English for cross-functional and overseas communication Contact: minfang.zhou@infineon.cn, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.