infineon
infineon17h ago
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Staff Engineer Unit Process Engineering-Die Bonding_5199

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OtherStaff Engineer
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Quick Summary

Overview

Own the Die Bonding process for daily sustaining, ensuring stable production while driving continuous improvements in quality, yield, andproductivity Your Role Key responsibilities in your new role 1.

Technical Tools
OtherStaff Engineer
Own the Die Bonding process for daily sustaining, ensuring stable production while driving continuous improvements in quality, yield, andproductivity Your Role Key responsibilities in your new role 1. Own the Die Bonding process for daily sustaining, ensuring stable production while driving continuous improvements in quality, yield, and productivity 2. Manage daily DDM and MRB activities, lead deviation investigations,and implement corrective and preventive actions to maintain processs tability 3. Analyze process performance using statistical tools and production data to identify root causes of abnormalities and implement effective solutions 4. Develop strong understanding of process fundamentals, equipment principles, and material characteristics to optimize process parameters and improve process capability 5. Lead change management, risk assessment, and mitigation activities toensure smooth implementation of process or equipment changes 6. Support equipment qualification, defect characterization, commonalitystudies, and yield improvement initiatives through data analysis andmachine learning 7. Maintain, update and new create key process documentation including Process Flow, PFMEA, SOP, OCAP, and Control Plan Your Profile Qualifications and skills to help you succeed 1. Bachelor’s Degree in Mechanical, Mechatronics, ElectronicsEngineering, or a related field 2. A minimum of 3 years’ hands-on experience in die bonding processes within semiconductor packaging & manufacturing 3. Familiar with IATF 16949 standards and change management processes 4. Proficient in problem-solving methodologies and quality toolsincluding 8D, DMAIC, FMEA, Lean Six Sigma, and SPC/APC 5. Strong statistical data analysis capability and systematic, logicalthinking 6. Good communication and leadership skills, with the ability to workeffectively in cross-functional teams 7. Good written and spoken English for international communication Contact: Alice.Shi-EE@infineon.cn, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

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Listing Details

Posted
June 4, 2026
First seen
June 4, 2026
Last seen
June 4, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
51%
Scored at
June 4, 2026

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infineonStaff Engineer Unit Process Engineering-Die Bonding_5199